 
SOLDER PASTE
| Lead content | PN | Alloy | Melting Point | Type | Halogen-Free | Halogen containing | 
| Lead-Free | PF606 | Sn96.5/Ag3.0/Ciu0.5 | 217-219 °C | T3-T6 | √ | √ | 
| PF629 | Sn99.0/Ag0.3/Cu0.7 | 217-226 °C | T3-T5 | √ | √ | 
| PF602 | Sn42/Bi58 | 139 °C | T3-T4 | √ | √ | 
| Lead containing | SH-62 | Sn62/Pb36/Ag2 | 179-189 °C | T3-T4 | √ | √ | 
| SH-63 | Sn63/Pb37 | 183 °C | T3-T4 | √ | √ | 
 
 
| Type | Particle size | 
| T3 | 20-45 μm | 
| T4 | 20-38 μm | 
| T5 | 15-25 μm | 
| T6 | 5-15 μm | 
| T7 | 2-12 μm | 
| T8 | 2-10 μm | 
 
 
 
Special Applications
- Low temperature
- Wafer Bumping
- Laser soldering
- Water soluble
- Dispensing
 
-  High temperature
- PoP
- LED (low voiding)
- Room temperature storable
- Jetting 
 
 
Packaging
- Jars 250g – 500g – 2000g
- Semco cartridges – 6oz (600g) – 12oz (1200g)
- Syringes – 10cc (30g) – 30cc (100g) – 55cc (150g)
SOLDER WIRE (flux cored)
| PN | Alloy | Flux content | Diameters | Reel size | 
| PF604-R | Sn99.3/Cu0.7 | 3±1% | 0.5 – 0.7 – 1.0mm | 500g | 
| PF606-R | Sn96.5/Ag3.0/Cu0.5 | 3±1% | 0.5 – 0.7 – 1.0mm | 500g | 
| RH63-A | Sn63/Pb37 | 2±1% | 0.5 – 0.7 – 1.0mm | 500g | 
 
Other Alloys, diameters (0.3 – 3.0mm), fluxes and reel sizes upon request. Solid wires (without flux) are also available.
SOLID SOLDER WIRE
| PN | Alloy | Flux content | Diameters | Reel size | 
| PF606-H | Sn96.5/Ag3.0/Cu0.5 | without Flux | 3.0mm | 4000g | 
 
SOLDER BAR
| PN | Alloy | Melting Point | 
| PF606-B | Sn96.5/Ag3.0/Cu0.5 | 217-219 °C | 
| PF629-B | Sn99/Ag0.3/Su0.7 | 217-226 °C | 
 
| PF604-B | Sn/Cu0.7 | 227-228 °C | 
| PF665-B | Sn/Cu0.7/Ni0.025/Ge0.01/Ag0.05 | 227-228 °C | 
| PF660-B | Sn/Cu0.2/Ni0.03/Ga0.002 | 232-234 °C | 
| H63S-B | Sn63/Pb37 | 183 °C | 
 
Other alloys upon request.
SOLDER FLUX
| PN | Application | 
|---|
| SMF-2 | For BGA rework | 
| SMF-2L | For BGA rework with lower viscosity | 
| SMF-08 | For BGA ball attachment | 
| SMF-B01 | For BGA ball attachment, especially for μBGA
 | 
| SM-816 | Liquid flux for wave soldering | 
SOLDER SPHERE
Other alloys upon request. Solder spheres are available in diameters ranging from 0,05 – 0,76 mm.
SOLDER PREFORM
Standard alloys: SAC305
Standard sizes: 0201, 0402, 0603, 0805
Standard packaging: Tape&Reel
Other alloys, shapes and packaging types upon request.