PF685-S Solder BGA Sphere

PF685-S SOLDER BGA SPHERE

Product description

Alloy: Sn/Ag4.0/Cu0.5
Melting point: 217 – 219 °C
Sphere diameter: 0.05 – 0.76 mm

Sphere diameter tolerances

Level Diameter (mm) Tolerances (mm)
Solder Sphere 0.5 – 0.76 ±0.02
0.3 – 0.49 ±0.01
0.1 – 0.29 ±0.005
Micro Solder Sphere 0.05 – 0.095 ±0.003


AVAILABLE OPTIONS FOR SOLDER BGA SPHERES

If interested, please contact us for a specific offer.

Name Alloy Composition Melting Point (°C) 
BGA Series 
PF682-S Sn/Ag1.2/Cu0.5+Ni 217-227
PF683-S Sn/Ag1.0/Cu0.5 217-227
PF684-S Sn/Ag3.0/Cu0.5 217-219
PF685-S Sn/Ag4.0/Cu0.5 217-219
PF687-S Sn/Ag3.5 220-222
PF698-S Sn/Ag2.6/Cu0.6 217-219
PF906-S Sn/Ag4.0/Cu0.5+Bi 210-217
PF908-S Sn 230-233
PF909-S Sn/Ag3.0/Cu0.5+Bi 210-217
PF912-S Sn/Ag2.0/Cu0.5+Bi 210-225
PF623-S Sn/Sb5.0 238-241
Low Temperature BGA Series
PF602-S Sn/Bi58 139
PF653-S Sn/Bi57/Ag1.0 137-142
PF676-S Sn/Bi57.6/Ag0.4 137-142
PF713-S Sn/Bi17/Vu0.5 184-209
PF714-S Sn/Bi35/Ag1.0 138-187
PF734-S Sn/Bi40/Ag/X 137-170
PF735-S Sn/Bi57/Ag/X 137-142
PF743-S Sn/Bi48/Ag/X 137-155