SHENMAO Celebrates 50 Years of Developing Solder Materials

SHENMAO America, Inc. is celebrating its 50th anniversary as a leading manufacturer of solder materials. Recognized as an award-winning supplier in the fields of electronics assembly and semiconductor packaging, the company has earned a reputation for delivering exceptional service.

Leveraging years of research and development, SHENMAO has gained approval from numerous internationally renowned electronics manufacturers. This recognition has propelled SHENMAO’s products into a wide range of applications, from consumer electronics like motherboards, notebooks, and desktop PCs, to high-reliability electronics such as server boards, medical devices, military equipment, and low-orbit satellite communications.

Dr. Ken Lin, Director of SHENMAO’s Advanced Material Development Center, commented, “As electric vehicles continue to evolve, there is an increasing need for more durable solder materials that meet stringent reliability and process window requirements. Concurrently, environmental, social, and governance (ESG) considerations are pushing manufacturers to reduce carbon emissions. To address these challenges, we at SHENMAO are developing innovative soldering solutions that will keep us at the forefront of the industry for the next 50 years.”

In response to the rapidly evolving landscape of packaging technologies, SHENMAO is committed to innovating solder materials that meet current market demands. The company also actively collaborates with well-known EMS factories. Building on decades of experience in related processes and materials, SHENMAO established an independent testing laboratory, CHEETAH Inspection Inc., in 2020. CHEETAH has received ISO/IEC 17025 certification for its laboratory quality management system and specializes in testing and verifying the reliability and failure analysis of various products and processes.


San Lien Lee, Founder, Chairman & Kelvin Li, CEO

SHENMAO specializes in the production of a wide array of solder products to meet diverse industry needs. Our offerings include:

  • Water-Soluble and No-Clean Solder Paste
  • Laser Solder Paste
  • Solder Preforms
  • Cored Solder Wire
  • Wave Solder Bar Alloys
  • Wave Soldering Fluxes
  • Extremely Pure Solder Powder up to Type 8
  • BGA and Micro BGA Solder Spheres
  • Wafer Level Packaging Solder Paste and Fluxes
  • LED Die Attach Paste
  • High-Performance Liquid Fluxes
  • Solar Ribbon
  • Plating Anodes

These products are designed for use in various processes, including PCB fabrication, assembly, and semiconductor packaging.

For more information, please visit

NeVo participated in the SMT Info seminar

Kateřina Navláčilová from NeVo attended the SMT Info seminar where she presented new trends in soldering. The topic of the presentation from Watson Tseng (Shenmao Technology Inc.) was Thermal Fatigue Resistance Lead-free Solder Paste. This very interesting presentation was focused on the PF918-P250 alloy designed for higher thermal stability.

Shenmao PF918-250 SAC alloy with Sn/Ag4.0/Bi3.0 composition have increased thermal stability properties, better mechanical shock reliability and very similar melting temperature range (~220°C). PF918 alloy is also available in BGA balls form.

Shenmao R&D department has shown through extensive testing that compared to conventional SAC alloy, the PF918 BGA solder balls have ⅓ more cycles to first fail during thermal cycling test. This great result is achieved thanks to an inhibition mechanism during crack propagation.

Mechanical shock tests for these BGA balls showed that PF918 has comparable results to Sn/Ag3.0/Cu0.5.

When we focus on solder paste with this specific composition PF918 Sn/Ag4.0/BiX with very good printing properties, the thermal cycling test results are comparable, but mechanical shock tests are even much better. The paste was also examined in terms of SIR and the probability of voids presence. SIR test based on IPC-TM-650 standard showed very good results.

Wide void testing proved, that void presence is lower comparable to SAC305 on air and also with using N2 (O2 < 3000 ppm) heating ambient.

Big advantage is that PF918 has a melting temperature range comparable to SAC alloys, so it’s not necessary to change temperature reflow profiles. In many cases it is even possible to use the ones currently in use.

PF918-P250 alloy has no significant environmental impact (Sn, Ag, Bi), complies with RoHS & RoHS 2.0, compiles with REACH. No used compounds are listed in SVHC.


NeVo at the fair Productronica 2021

We are taking part in this year’s Productronica 2021 trade fair in Munich, from the 16th-19th November, we will be very happy to meet you.
At the fair, we will introduce you to our entire portfolio of services and products, we are ready and look forward to all your questions.

Come and join us for coffee.
We look forward to seeing you in hall A4, stand 311.

If you need a free ticket, contact us.
The NeVo team.



New Joint Enhanced Solder Paste and Solder Joint Encapsulation Material Flux from NeVo

NeVo GmbH is pleased to introduce its new Joint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.

The new SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well. 

NeVo offers halogen-free JEP/SJEM materials. Halogen can generate hazardous gas at high temperatures and its use is restricted. NeVo halogen-free JEP/SJEM materials meet J-STD standard (≦1000ppm Chlorine/ ≦ 1000ppm Bromine) and IEC standard (≦900ppm Chlorine/ ≦ 900ppm Bromine/ ≦ 1500ppm Total halogens).

Influence of Electric Current at Solidification of Solder

Influence of Electric Current at Solidification of Solder

Does the electric current have any effect on the solder during solidification?
Our solders were used for further research. This time it was about the Influence of Electric Current at Solidification of Solder.
The Department of Microelectronics at the Technical University in Brno is still conducting research and we are glad that our soldering materials can contribute to their testing.

This work deals with the investigation of influence of electric current flow on the inner structure of solder alloy SAC305 during solidification. Methodology of this experiment was as follows:

  • Establishment of experimental melting station (Figure 1) constructed of quartz tube, resistance wire (heating element – Kanthal), electrodes (braze) and stage.
  • Verification of homogenous temperature distribution on quartz tube (Figure 2).
  • Melting of SAC305 solder alloy up to temperature 300 °C.
  • Solidification of solder WITH and WITHOUT electric current. The value of the electric current was 7.5 A. the final sample had the shape of a cylindrical ingot.
  • After the samples preparation, the metallographic cross-sections were done. Chemical wet etching was used for highlighting of the inner structure.
Figure 1: Experimental melting station with the possibility of the connection of electrical current flow
Figure 2: Infrared thermograph of temperature distribution on the experimental melting station

Prepared samples were analyzed by SEM (Scanning Electron Microscope) and EDX (Energy Dispersive X-Ray). Results showed that the sample without connected electric current during solidification had regular arrangement of β Sn dendrites (Figure 3 – SEM). On the contrary, the sample with connected electric current during solidification showed greater disorder in β Sn dendrites grow (Figure 4 – SEM). Moreover, intermetallic parts from the braze electrodes were dispersed in the bulk solder of ingot in comparison to the sample without connected electric current (Figure 4 – EDX) where the intermetallic parts were observed only at the bottom side. These results are preliminary for the further research of this phenomenon.

Figure 3: Sample without electric current during solidification – SEM photo (left) and EDX photo (right)
Figure 4: Sample with electric current during solidification – SEM photo (left) and EDX photo (right)

The full paper is available at the link:

We thank the team from the University of Brno and look forward to further interesting tests of our soldering materials.

Influence of heat flow direction on solder ball interfacial layer

Influence of heat flow direction on solder ball interfacial layer

We always try to support the development and technical studies of universities. Now, as a supplier of solder balls and solder flux, we have joined the project: Influence of heat flow direction on solder ball interfacial layer.

During the soldering process, a large number of factors influence the quality of the solder joint. If we focus on the intermetallic layer and the intermetallic compounds for the SAC305 soldering alloy, some fundamental parameters influencing their formation and growth have been identified.

When supplying soldering materials, we often encounter testing of different proportions of impurities. We always try to help advise what ratio is ideal for a particular operation. Thanks to the fact that our production is in the Czech Republic, we can flexibly respond to the needs of our customers and supply soldering materials in a very short time.

The results of the solder-copper interface analysis showed different values in terms of the thickness of the intermetallic layer and its roughness. One of the basic parameters that could influence the test results was the soldering profile. For exact verification of the correct settings of the temperature profiles, a heating factor calculation was used to help optimize the soldering profile from the point of view of reliability control, repeatability, soldering process and quality of the resulting soldered joint.

More information can be found in the attached document, which relates to the work. Thank you for participating in this project.


Příspěvek „The Quality of BGA Solder Joint with Underfill“ je chráněn heslem The Quality of BGA Solder Joint with Underfill

The Quality of BGA Solder Joint with Underfill

Brno, March 28th, Quality of NeVo SAC305 BGA solder joint with underfilled was studied by Brno University of Technology graduate student A.Otáhal.

The research study, supported by NeVo, is investigating mechanical behavior (shear strength) of soldered BGA package with and without underfill on FR4 and Al2O3 carriers.BGA soldered on FR4 (ENIG) had higher value of shear strength than BGA soldered on alumina substrate with conductive thick film layer. Results was used for validation of virtual model and simulation in ANSYS Workbench. This simulation will be used for prediction of thermomechanical behavior of BGA packages soldered on alumina substrates and on organic substrates FR4.

The full paper is available at the link here.

NeVo Solder

NeVo certified to ISO 9001:2015

NeVo confirms its high quality solder paste manufacturing standards by ISO 9001:2015 certification.

Solder paste and soldering products manufacturer and distributor NeVo® has made its Brno facility site certified by the latest ISO 9001:2015 standards.

“The successful qualification of NeVo company to the latest 2015 version of ISO 9001 standards is a confirmation of our key focus to deliver soldering products at the highest quality and technology level” said Daniel Pospisil, Technical Marketing Manager of NeVo.

The certificates in German, English and Czech languages are available here.

NeVo scores at solder paste vapour phase test

NeVo scores at solder paste vapour phase test

Solder paste and soldering products manufacturer and distributor NeVo® has achieved an „excellent“ scoring result of their lead-free solder paste product PF606-P30 at vapour phase assembly evaluation test performed by Exmore company.

The scoring included multiple parameter benchmarking evaluation including solderability, visual appearance and mechanical strength properties. The vapour phase technology is featuring high level safety for humans including low harmful inhalation risk.

The benchmarking was performed using the reference vapour phase liquid Galden LS230 with boiling point at 230 degrees Celsius.

“We are pleased with the achievement in this independent benchmarking test. Vapour phase assembly method is currently side of the mass volume assembly, but it may be important in some special applications. It is a high motivation for us to continue with our product development and services” said Daniel Pospisil, Technical Marketing Manager of NeVo.

NeVo Introduce New Low Viscosity Soldering Pastes

NeVo Introduce New Low Viscosity Soldering Pastes

NeVo is pleased to announce release of its new low viscosity solder pastes SnAg3.0Cu0.5 PF606-P214 and ultra low viscosity PF606-P214L.

The offer of lead-free, halide-free most favourite soldering paste PF606-P30 has been extended by its lower viscosity alternatives P214 and P214L.

” We react on customer feedback and needs for lower viscosity products, while maintaining excellent parameters of our standard P30 solder paste.” said Daniel Pospisil, NeVo Technical Manager

The new solder paste PF606-P214 is featuring low viscosity of 170Pa.s and the PF606-P214L even lower viscosity of 100Pa.s, while the standard PF606-P30 paste viscosity is 200Pa.s. PF606-P214L paste is also recommended for dispensing.