Influence of heat flow direction on solder ball interfacial layer

Influence of heat flow direction on solder ball interfacial layer

We always try to support the development and technical studies of universities. Now, as a supplier of solder balls and solder flux, we have joined the project: Influence of heat flow direction on solder ball interfacial layer.

During the soldering process, a large number of factors influence the quality of the solder joint. If we focus on the intermetallic layer and the intermetallic compounds for the SAC305 soldering alloy, some fundamental parameters influencing their formation and growth have been identified.

When supplying soldering materials, we often encounter testing of different proportions of impurities. We always try to help advise what ratio is ideal for a particular operation. Thanks to the fact that our production is in the Czech Republic, we can flexibly respond to the needs of our customers and supply soldering materials in a very short time.

The results of the solder-copper interface analysis showed different values in terms of the thickness of the intermetallic layer and its roughness. One of the basic parameters that could influence the test results was the soldering profile. For exact verification of the correct settings of the temperature profiles, a heating factor calculation was used to help optimize the soldering profile from the point of view of reliability control, repeatability, soldering process and quality of the resulting soldered joint.

More information can be found in the attached document, which relates to the work. Thank you for participating in this project.


productronica 2021

Productronica 2021

We look forward to seeing you at Productronica 2021

About productronica
productronica is the world’s leading trade fair for electronics development and production and is supported by the Productronics Association in the German Engineering Federation (VDMA) as a conceptual partner. It has taken place in Munich every two years since 1975 and is a core element of the electronics trade fair network of Munich International Trade Fair.

NeVo at Productronica 2019

Productronica 2019 – Thank you for your visit!

Productronica 2019 was another success for our company and we would like to thank you so much for stopping by.
We always welcome every opportunity to discuss production challenges with our customers.

If you did not visit our stand, please have a look at our award winning low temperature solder paste.


NeVo Amper 2018

Amper 2018 Exhibition

We presented our products at Amper 2018 in Brno.

In our stand, you could have seen the latest innovations in soldering materials.
Thanks to the fact that we can respond very quickly to the needs of our clients and we are a direct manufacturer of solder paste, we can offer high quality and always fresh solder paste and its distribution within EMEA.

Thanks to everyone who visited our booth and we look forward to meeting you at Amper 2019.

NeVo ISO 14001:2015 certificate


NeVo confirms its commitment to a better environment by achieving ISO 14001 certification.

We have achieved the goal we have set. It has been confirmed that our services in the area of purchase, sale, and production of solder pastes meet all the requirements arising from ISO 14001:2015.

The certificates in German, English and Czech languages are available here.

NeVo at Productronica 2017

Productronica 2017

Productronica 2017 is over.

Thank you to everyone who visited us at Productronica 2017.
We presented the entire portfolio of our products. You could have seen the quality and availability of solder pastessolder wires, and other of our products.

“We really appreciate everyone who stopped by. We answered many interesting questions and we have established several promising future partnerships” said Daniel Pospíšil, Director of NeVo GmbH.

Have you missed our booth and have any questions? Get in touch with us. We will be happy to answer all your questions.

Příspěvek „The Quality of BGA Solder Joint with Underfill“ je chráněn heslem The Quality of BGA Solder Joint with Underfill

The Quality of BGA Solder Joint with Underfill

Brno, March 28th, Quality of NeVo SAC305 BGA solder joint with underfilled was studied by Brno University of Technology graduate student A.Otáhal.

The research study, supported by NeVo, is investigating mechanical behavior (shear strength) of soldered BGA package with and without underfill on FR4 and Al2O3 carriers.BGA soldered on FR4 (ENIG) had higher value of shear strength than BGA soldered on alumina substrate with conductive thick film layer. Results was used for validation of virtual model and simulation in ANSYS Workbench. This simulation will be used for prediction of thermomechanical behavior of BGA packages soldered on alumina substrates and on organic substrates FR4.

The full paper is available at the link here.

NeVo Solder

NeVo certified to ISO 9001:2015

NeVo confirms its high quality solder paste manufacturing standards by ISO 9001:2015 certification.

Solder paste and soldering products manufacturer and distributor NeVo® has made its Brno facility site certified by the latest ISO 9001:2015 standards.

“The successful qualification of NeVo company to the latest 2015 version of ISO 9001 standards is a confirmation of our key focus to deliver soldering products at the highest quality and technology level” said Daniel Pospisil, Technical Marketing Manager of NeVo.

The certificates in German, English and Czech languages are available here.

NeVo scores at solder paste vapour phase test

NeVo scores at solder paste vapour phase test

Solder paste and soldering products manufacturer and distributor NeVo® has achieved an „excellent“ scoring result of their lead-free solder paste product PF606-P30 at vapour phase assembly evaluation test performed by Exmore company.

The scoring included multiple parameter benchmarking evaluation including solderability, visual appearance and mechanical strength properties. The vapour phase technology is featuring high level safety for humans including low harmful inhalation risk.

The benchmarking was performed using the reference vapour phase liquid Galden LS230 with boiling point at 230 degrees Celsius.

“We are pleased with the achievement in this independent benchmarking test. Vapour phase assembly method is currently side of the mass volume assembly, but it may be important in some special applications. It is a high motivation for us to continue with our product development and services” said Daniel Pospisil, Technical Marketing Manager of NeVo.