PF606-B Lead Free Solder Bar
Product description
Alloy: Sn/Ag3.0/Cu0.5
Melting point: 217-219°C
Packaging: 1.0kg/pcs, 20kg/box
Solder bar for plating process or wave soldering process.
Composed of virgin raw metals with low impurities.
AVAILABLE OPTIONS FOR SOLDER BARS
If interested, please contact us for a specific offer.
| Alloy | Composition | Melting Point (°C) |
|---|---|---|
| SnAgCu Series | ||
| PF606-B | Sn/Ag3.0/Cu0.5/X | 217-219 |
| PF629-B | Sn/Ag0.3/Cu0.7 | 217-226 |
| PF632-B | Sn/Ag1.0/Cu0.5 | 217-226 |
| SnCu Series | ||
| PF604-B | Sn/Cu0.7 | 227-228 |
| PF643-B | Sn/Cu0.7/Ni0.04 | 227-228 |
| PF656-B | Sn/Ag0.05/Cu0.7/X | 227-228 |
| PF660-B | Sn/Cu0.2/Ni0.03/Ga0.002 | 227-228 |
| PF665-B | Sn/Cu0.7/Ni0.025/Ge0.01/Ag0.05 | 227-228 |
| PF731-B | Sn/Cu3.0/Ni0.2/X | 227-340 |
| PF732-B | Sn/Cu5.0/Ni0.2/X | 227-370 |
| SnAg Series | ||
| PF616-B | Sn/Ag4.0 | 221-225 |
| Pure Sn Series | ||
| PF605-B | Sn99.99 | 232 |
| Lead Containing Series | ||
| SH63-B | Sn/Pb37 | 183 |
| SH62-B | Sn/Pb36/Ag2 | 179 |
| SH-0595-B | Sn/Pb95 | 308-312 |
| SH-05X25-B | Sn/Pb92.5/Ag2.5 | 280-284 |
| SH-10882-B | Sn/Pb88/Ag2 | 268-290 |
| Low Temperature Series | ||
| PF602-B | Sn/Bi58 | 139 |
| PF653-B | Sn/Bi57/Ag1.0 | 137-142 |
| PF676-B | Sn/Bi57.6/Ag0.4 | 137-142 |
| PF735-B | Sn/Bi57/Ag/X | 137/142 |
| SnSb Series | ||
| PF623-B | Sn/Sb5.0 | 238-241 |
| PF726-B | Sn/Sb10 | 245-266 |
Solder Bar is made from high purity metal resulting in low drossing and is suitable for dip and wave soldering. The quality meets JIS-Z-3282.